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In situ diagnostics and prognostics of solder fatigue in IGBT modules for electric vehicle drives

机译:电动汽车IGBT模块中焊料疲劳的原位诊断和预测

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摘要

This paper proposes an in situ diagnostic and prognostic (D&P) technology to monitor the health condition of insulated gate bipolar transistors (IGBTs) used in EVs with a focus on the IGBTs' solder layer fatigue. IGBTs' thermal impedance and the junction temperature can be used as health indicators for through-life condition monitoring (CM) where the terminal characteristics are measured and the devices' internal temperature-sensitive parameters are employed as temperature sensors to estimate the junction temperature. An auxiliary power supply unit, which can be converted from the battery's 12-V dc supply, provides power to the in situ test circuits and CM data can be stored in the on-board data-logger for further offline analysis. The proposed method is experimentally validated on the developed test circuitry and also compared with finite-element thermoelectrical simulation. The test results from thermal cycling are also compared with acoustic microscope and thermal images. The developed circuitry is proved to be effective to detect solder fatigue while each IGBT in the converter can be examined sequentially during red-light stopping or services. The D&P circuitry can utilize existing on-board hardware and be embedded in the IGBT's gate drive unit.
机译:本文提出了一种原位诊断和预后(D&P)技术,以监控EV中使用的绝缘栅双极型晶体管(IGBT)的健康状况,重点关注IGBT的焊料层疲劳性。 IGBT的热阻和结点温度可用作寿命状态监测(CM)的健康指标,在该状态下,测量端子特性,并将器件内部的温度敏感参数用作温度传感器,以估算结点温度。可以从电池的12 V直流电源转换而来的辅助电源单元,可以为原位测试电路供电,并且CM数据可以存储在车载数据记录器中,以进行进一步的离线分析。所提出的方法在开发的测试电路上进行了实验验证,并与有限元热电模拟进行了比较。还将热循环的测试结果与声学显微镜和热图像进行了比较。事实证明,开发的电路可有效检测焊料疲劳,同时在红灯停止或维修期间可以顺序检查转换器中的每个IGBT。 D&P电路可以利用现有的板载硬件,并嵌入IGBT的栅极驱动单元中。

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